Sputtering

In sputtering, a thin metallic coat is deposited on the workpiece within a vacuum chamber.  The source metal (the cathode) is caused to vaporize and accelerate toward the workpiece (the anode), where it is deposited as a thin layer of metal.

Process Characteristics

Is performed in a vacuum chamber
Transfers a metallic deposit via ionized gas molecules
Typically utilizes common metals and alloys
Must be performed on clean surfaces
Is relatively slow; it may take hours to acquire a 0.1-micron thick coat

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Information provided is from Manufacturing Processes Reference Guide by Robert H. Todd, Dell K. Allen, and Leo Alting.--1st ed. Published by Industrial Press Inc., 1994.