In sputtering, a thin metallic coat is
deposited on the workpiece within a vacuum chamber. The source
metal (the cathode) is caused to vaporize and accelerate toward the
workpiece (the anode), where it is deposited as a thin layer of metal.
Process Characteristics
Is performed in a vacuum chamber
Transfers a metallic deposit via ionized gas
molecules
Typically utilizes common metals and alloys
Must be performed on clean surfaces
Is relatively slow; it may take hours to acquire a
0.1-micron thick coat
Information provided is from Manufacturing Processes Reference
Guide by Robert H. Todd, Dell K. Allen, and Leo Alting.--1st ed. Published by
Industrial Press Inc., 1994.