Metal Bath Dip Soldering

Metal bath dip soldering is defined as a metal-joining process where the workpieces to be joined are immersed in a pot of molten solder.  Because of the relatively low melting temperature of the solder (between 350 and 600 degrees F), only adhesion between the solder and the workpieces results.  A flux or metal cleaner is used to prepare the workpiece for bonding with the solder.  Typically, dip soldering is an automated process used extensively in the electronics assembly industry.

Process Characteristics

Uses a pot of molten solder to join workpieces
Requires an application of flux
Is a relatively low temperature joining process where no fusion takes place
Requires an immersion period of between 2 and 12 seconds
Can be successfully automated
Is used extensively in the electronics assembly industry

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Information provided is from Manufacturing Processes Reference Guide by Robert H. Todd, Dell K. Allen, and Leo Alting.--1st ed. Published by Industrial Press Inc., 1994.